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Power chips are linked to outside circuits through product packaging, and their efficiency depends on the assistance of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection refers to the electric connection on the top surface area of the chip, which is generally aluminum bonding cord in traditional components. ^
Typical power module package cross-section

At present, commercial silicon carbide power modules still mainly make use of the packaging modern technology of this wire-bonded typical silicon IGBT module. They deal with problems such as large high-frequency parasitical parameters, not enough heat dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit the use of silicon carbide semiconductors. The display screen of outstanding efficiency. In order to address these issues and completely exploit the significant prospective advantages of silicon carbide chips, lots of new packaging technologies and services for silicon carbide power modules have emerged in the last few years.

Silicon carbide power module bonding method


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have developed from gold cord bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have established from gold cables to copper cords, and the driving pressure is price decrease; high-power tools have actually established from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve item efficiency. The higher the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a strong copper bridge soldered to solder to connect chips and pins. Compared with typical bonding packaging approaches, Cu Clip technology has the following benefits:

1. The connection between the chip and the pins is made of copper sheets, which, to a certain level, replaces the standard cable bonding approach in between the chip and the pins. Therefore, a special package resistance value, higher present circulation, and better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.

3. The item look is totally regular with normal products and is primarily used in servers, portable computer systems, batteries/drives, graphics cards, motors, power materials, and various other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding technique

Both eviction pad and the Resource pad are clip-based. This bonding method is a lot more expensive and complex, however it can accomplish better Rdson and much better thermal impacts.


( copper strip)

Copper sheet plus cord bonding method

The source pad makes use of a Clip technique, and eviction makes use of a Wire method. This bonding method is slightly cheaper than the all-copper bonding technique, saving wafer location (suitable to really small gateway locations). The procedure is less complex than the all-copper bonding technique and can get much better Rdson and much better thermal impact.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper cable clip, please feel free to contact us and send an inquiry.

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